Cutting with diamond wire or waterjet

Diamond wire sawing is the most flexible cutting method in the field of quality assurance for component and material analysis. Thinnest cut-offs between 0.08 and 0.5 mm are possible. Due to the "gentle" cut, there is no significant heat input, so that even temperature-sensitive parts such as rubber can be cut. Both wet and dry cutting is possible. The cut-offs are usually precise, even and smooth. The cut edges are sharp-edged - without bridging. When cutting composite materials, there is no smearing between the different materials. Cutting heights of up to 375 mm are no problem. A disadvantage could be the cutting time due to the low feed rate, but this is less important in laboratories.

Due to these properties and the simple and safe operation of a diamond wire saw, more and more laboratories around the world are opting for this cutting technology or are supplementing their machine portfolio with it.

Waterjet cutting is only suitable as an analytical cutting process to a limited extent. The cold cut, with simultaneous high cutting speed, is not possible with any other cutting process. However, the surface quality is less good compared to diamond wire sawing. Likewise, the installation space of a waterjet cutting system is significantly larger and therefore impractical for use in laboratories.

In order to check which cutting process is better for your needs, it is advisable to have test cuts made with both processes on your workpiece samples.