Cutting with diamond wire or laser beam

Diamond wire saws DWS.175, DWS.250, DWS.250E

Diamond wire sawing is the most flexible cutting method in the field of quality assurance for component and material analysis. Thinnest cut-offs between 0.08 and 0.5 mm are possible. Due to the "gentle" cut, there is no significant heat input, so that even temperature-sensitive parts such as rubber can be cut. Both wet and dry cutting is possible. The cut-offs are usually precise, even and smooth. The cut edges are sharp-edged - without bridging. When cutting composite materials, there is no smearing between the different materials. Cutting heights of up to 375 mm are no problem. A disadvantage could be the cutting time due to the low feed rate, but this is less important in laboratories.

Due to these properties and the simple and safe operation of a diamond wire saw, more and more laboratories around the world are opting for this cutting technology or are supplementing their machine portfolio with it.

Laser cutting has become an indispensable part of industrial cutting technology. This process is used to cut components out of sheet materials. The cutting gap width of this cutting process is extremely small at 0.04 mm. The advantage is that two-dimensional contours can be easily created with the aid of a CNC-controlled laser head. However, the process is very slow due to its low feed rate and the acquisition costs of a laser machine are very high. The emission of irritant gases and dust must be taken into account. In addition, the thermal energy introduced alters the structure of the surface layer of the workpieces and is therefore unsuitable for metallographic analyses.

In order to check which cutting process is better for your needs, it is advisable to have test cuts made with both processes on your workpiece samples

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