Cutting with diamond wire or diamond wheels
Diamond wire sawing is the most flexible cutting method in the field of quality assurance for component and material analysis. Thinnest cut-offs between 0.08 and 0.5 mm are possible. Due to the "gentle" cut, there is no significant heat input, so that even temperature-sensitive parts such as rubber can be cut. Both wet and dry cutting is possible. The cut-offs are usually precise, even and smooth. The cut edges are sharp-edged - without bridging. When cutting composite materials, there is no smearing between the different materials. Cutting heights of up to 375 mm are no problem. A disadvantage could be the cutting time due to the low feed rate, but this is less important in laboratories.
Due to these properties and the simple and safe operation of a diamond wire saw, more and more laboratories around the world are opting for this cutting technology or are supplementing their machine portfolio with it.
Wet grinding, i.e. cutting with a diamond wheel, is also often used in component and material analysis laboratories. To prevent the diamond wheels from fluttering, high speeds are required. This in turn requires a tight clamping of the workpiece, which can lead to deformations, especially with thinner parts. Likewise, the workpieces must be cooled so that the temperature entry into the workpiece is minimized. Although diamond cutting wheels are available from 0.15 mm, they have a diameter of less than 100 mm and a cutting depth of only 32 mm. In addition, this wet grinding process produces smearing when cutting composite materials, which makes subsequent material analysis more difficult.
A comparative cut between diamond wheels and a diamond wire should provide information on the more suitable use for your needs.