Cutting with diamond wire or band saw blade

Diamond wire sawing is the most flexible cutting method in the field of quality assurance for component and material analysis. Thinnest cut-offs between 0.08 and 0.5 mm are possible. Due to the "gentle" cut, there is no significant heat input, so that even temperature-sensitive parts such as rubber can be cut. Both wet and dry cutting is possible. The cut-offs are usually precise, even and smooth. The cut edges are sharp-edged - without bridging. When cutting composite materials, there is no smearing between the different materials. Cutting heights of up to 375 mm are no problem. A disadvantage could be the cutting time due to the low feed rate, but this is less important in laboratories.

Due to these properties and the simple and safe operation of a diamond wire saw, more and more laboratories around the world are opting for this cutting technology or are supplementing their machine portfolio with it.

Band sawing with a diamond-coated band enables the cutting of CFRP, ceramics, glass, metals and is only partially used for specimen preparations. Band thicknesses from 0.16 mm are used. The disadvantages are the significantly high tool costs (diamond bandsaw blades) and the lack of possibility to create a radius-free contour cut or cutout.

In order to check which cutting process is better for your needs, it is advisable to have test cuts made with both processes on your workpiece samples.